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Okamoto is a leading manufacturer of precision grinding and polishing tools since 1935.  Grinding tools used in applications of wafer manufacturing, SOI, TSV, MEMS, thin wafers down to 25 um, bonded wafers, bumped wafers, solar ingot grinding, quartz, sapphire, GaAs, InP and more.  Polishing tools used with CMP technology for high throughput and high accuracy.  All tools available up to 300mm.  For thin wafer applications, grind/polish systems can be integrated with a mounter, DAF, and detaper equipment as a complete in-line system.  Okamoto is ISO9002 certified.
Grinding Polishing Lapping Slicing TSV Solar
The machine can grind semiconductor material such as Si, GaAs andGaP, and can grind electronic material such as ferrite and ceramic. Utilizing the Okamoto grinding method, the machine can achieve high wafer throughput without influencing machining accuracy.
GNX201D300 
Dual-side wafer backgrinder with up to 300mm capability.  Used by wafer manufactucturers for high-throughput and high precision dual-side grind.
 
GNX200B 
Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.
Product Specifications
 
GNX200BP 
Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.
Product Specifications
 
GNX300B 
Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.
Product Specifications
 
GDM300 
Fully-Automatic Wafer Grinder and Dual Polish In-Line system for wafer thinning in production: 25 um capability.  Integrated Edge-grinder optional.  Non-contact laser thickness detection optional.  Available to dock directly to Detaper/Mounter unit.
Product Specifications
VG-202MKII 
For SOI wafer / Super precision grinder.
Product Specifications
 
VG-201 
For Si, GaAs and GaP.
 
VG-101MKII 
Vertical Grinder.
Product Specifications
 
VG-401MKII 
Semi-Automatic Wafer Grinder for Hard Materials Suitable for AlTic, SiC, Glass, Ceramics.
Product Specifications
 
VG-401H 
Semi-Automatic Wafer grinder for hard materials suitable for AlTic, SiC, Glass, Ceramics with in-process wheel dressing.  More rigid column and high horsepower motor.
SPL-500 
GaAs Polisher / 6 Spindle 1 Table
Semi-Automatic
 
SPP-600S/800S 
Semi-Automatic Wafer CMP system.
Product Specifications
 
SPP-4000 
Large plate pitch polisher plate dia. 4000mm
 
PNX332B 
Final Polisher.  Fully Automatic Polisher for 300 mm.
A lapping machine which can adapt to various conditions is necessary to obtain high accurate flatness in the process of wafer and electronic material. Okamoto's various lapping machines meet a wide range of needs. A machine can be selected to meet specific customer's requirements. Any model of the machine is easy to operate and suitable for mass productivity.
SPL-15 High Accuracy Lapping Machine 
Super high accuracy model equipped with air bearing to rotate surface plate.
Product Specifications
 
SPL-24 Lapping Machine 
Lapping machine with a 24 inch surface plate to cope with large size workpiece. It is equipped with a water protection cover to meet clean room requirements.
 
SPL-12 High Production Lapping Machine 
Combined technology with high speed rotation and low vibration.
 
SPL-120 Giant Lapping Machine 
Lapping machine with 120 inch plate.
 
TR-350 Special Trueing Machine 
Lapping machine with 120 inch plate.
Internal Blade
The internal blade slicer will cut ingots of brittle materials such as silicon, ferrite and quartz. Since the slicing process is important in the front end of wafer production, this machine is designed to make precision cuts with high accuracy . The Okamoto slicer is designed to reduce warpage and to cut high quality wafers.
ASM100A Internal Blade Type Slicer 
Fully Automatic slicer for cutting brittle electronic material up to 100mm diameter.
 
ASM200B Internal Blade Type Slicer 
Fully Automatic large slicer for semi-conductor raw material, capable of cutting ingots up to 200mm diameter.
 
ASM75A 
More information coming soon...
External Blade
The external slicer will cut and groove brittle materials such as glass, ferrite and ceramic with high accuracy and high efficiency. The machine is equipped with high-rigidity materials in the construction of the major components. Using the special materials in its drive, it is less influenced by environmental changes.
ASMUPX 
Y, Z axis full closed loop control system.
 
FSM250 Super-Precision Slicer 
Super precision slicer, equipped with special structure on table and spindle, ideal for cutting brittle electronic material.
 
ASM420M Multi Slicer 
Multi slicer, equipped with high power driving motor of 5.5 kw with high rigid column for slicing britle head material.
Product Specifications
 
ASM1G / 3G Slicer 
More information coming soon...
TSV300 
The TSV300 has been developed for TSV First application.
Integrated edge grinder, coarse/fine backgrinder, 3-stage polisher, and cleaning. The TSV300 uses our PNX332B polisher technology for via exposure.
 
TSV FIRST 
Via First :TSV process machine model line up.
Product Specifications
 
TSV LAST 
Via Last: TSV process machine model line up.
Product Specifications
 
GDM300 
Fully-Automatic Wafer Grinder and Dual Polish In-Line system for wafer thinning in production: 25 um capability.  Integrated Edge-grinder optional.  Non-contact laser thickness detection optional.  Available to dock directly to Detaper/Mounter unit.
Product Specifications
Solar Ingot Process 
Product Specifications
 
SiG154H 
Fully automated multi-step process sequence providing rough and fine grinding. One clamp centering system ensures proper centering for precision parallel side stock removal grinding. R Chamfering and C Chamfering.
 
SiS152H 
Solar squaring tool.  Able to square a cylindrical ingot by dual slicing spindles.  Can automatically load an ingot size of 220 x500mm (maximum).
 
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