Category: Grinding Fully Automatic

Fully-Automatic Wafer Grinder and Dual Polish In-Line system for wafer thinning in production: 25 um capability.  Integrated Edge-grinder optional.  Non-contact laser thickness detection optional.  Available to dock directly to Detaper/Mounter unit.

Fully-automatic wafer grinder with down-feed grinding method and Robotics wafer handling. 8″ and 12″ grinder.

Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.

Model GNX200B grinder is a fully-automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station.