Okamoto backgrinders, polishers, slicers, and lapping machines have been designed and developed to meet customers’ needs to process and handle a wide range of materials. Okamoto has experience with materials such as Silicon, GaAs, Sapphire, Quartz, Silicon Nitride, InP, SiC, AlTiC, and many others. Our tools can also be used for a wide range of wafer types and processes, such as SOI wafers, bonded wafers, bumped wafers, as well as TSV and MEMS processes, just to name a few. Please contact your local Okamoto Sales Representative for more information. https://youtu.be/AF9VK2rPZ_8
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